製程設備
SMT
Equipment Capability
| Placer | Model | Capability | Tolerance | |
| Printer | ASMPT | DEK | 0.3mm Pitch | ± 0.025mm |
| SPI | Sinic-Tek | InSPIre-510 InSPIre-510 a | XY:10 um Z:<1um | Check Area,Shape,Offset,Vol,Height,Bridge |
| Mounter | YAMAHA | Σ-G5S | 01005(chip size)Micro BGA | ± 0.03mm |
| Σ-G5S Ⅱ | 01005(chip size)Micro BGA | ± 0.03mm | ||
| N2 Reflow | ETC | NE/NIS | PB FREE | Heat W/N2 |
| Vacuum Reflow | ETC | RSV152ML-812(WD) | N2/Vacuum | Void Fraction < 10% |
| AOI | TRI | TR7700L Slll DT | 10 um(4 Mega Pixel Camera) | Missing,Off-center,Standing,Bridging |
| X-ray | TRI | TR7600F3D SII | 2D / 3D to 5μm image to 10X | BGA/QFN bridging,Off-center,Void |
DIP
專業提供DIP插件服務，滿足生產需求，所有產品均通過嚴格檢驗，保證品質穩定，符合客戶的各類要求。
組裝測試包裝
我們的組裝測試服務確保每一個產品在出廠前均能按照客戶要求進行嚴格測試，排除任何缺陷，以達到最佳的性能與可靠性。